Samsung mass produces high-density ePoP memory

Samsung Electronics announced Wednesday that it is now mass producing the industry’s first ePoP (embedded package on package) memory for smartphones for global mobile companies.

Last year, the electronics giant was the first in the industry to mass produce ePoP for use in wearable devices. ePoP combines all essential memory components -- mobile DRAM, NAND flash memory and controller -- into a single package that can be stacked directly on top of the mobile application processor.

It had been considered that NAND flash memory due to its vulnerability to heat can`t be stacked on top of a mobile processor that operates in high temperature. Samsung broke the norm by raising heat-resistance level. Samsung`s ePoP is a single memory package consisting of 3GB LPDDR3 DRAM, 32GB eMMC (embedded multi-media card) and a controller. It decreases the total area used by approximately 40 percent of conventional PoP, enabling a much thinner smartphone design and a mass storage battery.

"By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features,” said Baek Ji-ho, senior vice president of memory marketing at Samsung Electronics. “We plan to expand our line-up of ePoP memory with packages involving enhancements in performance and density over the next few years, to further add to the growth of premium mobile market.”